AI SearchMicrojoining and nanojoining / (Record no. 76242)
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| 000 -LEADER | |
|---|---|
| fixed length control field | 04547cam a2200421Ia 4500 |
| 005 - DATE AND TIME OF LATEST TRANSACTION | |
| control field | 20260818155144.0 |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION | |
| fixed length control field | 091221s2008 enka ob 001 0 eng d |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| International Standard Book Number | 9781615831845 |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| International Standard Book Number | 1615831843 |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| International Standard Book Number | 1845691792 |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| International Standard Book Number | 9781845691790 |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| International Standard Book Number | 9781845694043 |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| International Standard Book Number | 184569404X |
| 035 ## - SYSTEM CONTROL NUMBER | |
| System control number | .b1223204x |
| 245 00 - TITLE STATEMENT | |
| Title | Microjoining and nanojoining / |
| Statement of responsibility, etc. | edited by Y. Zhou. |
| 260 ## - PUBLICATION, DISTRIBUTION, ETC. | |
| Place of publication, distribution, etc. | Cambridge, England : |
| Name of publisher, distributor, etc. | Woodhead Pub. and Maney Pub., on behalf of the Institute of Materials, Minerals & Mining ; |
| Place of publication, distribution, etc. | Boca Raton : |
| Name of publisher, distributor, etc. | CRC Press, |
| Date of publication, distribution, etc. | 2008. |
| 300 ## - PHYSICAL DESCRIPTION | |
| Extent | 1 online resource (xxiv, 810 pages) : |
| Other physical details | illustrations. |
| 490 1# - SERIES STATEMENT | |
| Series statement | Woodhead Publishing in materials |
| 504 ## - BIBLIOGRAPHY, ETC. NOTE | |
| Bibliography, etc. note | Includes bibliographical references and index. |
| 505 0# - FORMATTED CONTENTS NOTE | |
| Formatted contents note | Introduction -- Basics of microjoining: Mechanisms of solid-state bonding processes / J.E. Gould. Mechanisms of soldering and brazing / T. Takemoto. Fundamentals of fusion microwelding / G.A. Knorovsky. Modeling of solid state bonding / Y. Takahashi. Modeling of fusion microwelding / B.H. Chang. Sensing, monitoring and control / M. Mayer. Assembly process automation and materials handling / Y.M. Cheung, D. Liu -- Microjoining and nanojoining processes: Microelectronics wire bonding / I. Lum, M. Mayer, Y. Zhou. Solid-state diffusion bonding / A. Shirzadi. Bonding using nanoparticles / A. Hirose. Diffusion soldering and brazing / M.L. Kuntz, Y. Zhou -- Laser Soldering / Y.H. Tian, C.Q. Wang -- Fluxless soldering / J.P. Jung -- Laser microwelding / I. Mityamoto. Electron beam microwelding / G.A. Knorovsky. Resistance microwelding / S. Fukumoto. Adhesive bonding / S. Bohm, G. Hemken, M. Wagner. Introduction to nanojoining / S. Sahin -- Microjoining of materials and applications of microjoining: Joining of high temperature superconductors / G. Zou. Joining of shape memory alloys / K. Uenishi, K.F. Kobayashi. Wafer bonding / J. Wei, Z. Sun. Plastics microwelding / I. Jones. Microjoining in medical components and devices / K.J. Ely, Y. Zhou. Hermetic sealing of solid oxide fuel cells / M. Brochu. Joining of bulk nanostructured materials / M. Brochu. Ceramic/metal bonding / A Wu. |
| 520 ## - SUMMARY, ETC. | |
| Summary, etc. | Many important advances in technology have been associated with nanotechnology and the miniaturization of components, devices and systems. Microjoining has been closely associated with the evolution of microelectronic packaging, but actually covers a much broader area, and is essential for manufacturing many electronic, precision and medical products. Part one reviews the basics of microjoining, including solid-state bonding and fusion microwelding. Part two covers microjoining and nanojoining processes, such as bonding mechanisms and metallurgy, process development and optimization, thermal stresses and distortion, positioning and fixturing, sensing, and numerical modelling. Part three discusses microjoining of materials such as plastics, ceramics, metals and advanced materials such as shape memory alloys and nanomaterials. The book also discusses applications of microjoining such as joining superconductors, the manufacture of medical devices and the sealing of solid oxide fuel cells. This book provides a comprehensive overview of the fundamental aspects of microjoining processes and techniques. It is a valuable reference for production engineers, designers and researchers using or studying microjoining technologies in such industries as microelectronics and biomedical engineering. Reviews the basics of nanojoining including solid-state bonding and fusion microweldingCovers microjoining and nanojoining processes such as bonding mechanisms and metallurgy, sensing and numerical modellingExamines applications of microjoining such as the manufacturing of medical devices, and the sealing of solid oxide fuel cells. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name entry element | Microelectromechanical systems |
| General subdivision | Design and construction. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name entry element | Nanoelectromechanical systems |
| General subdivision | Design and construction. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name entry element | Microtechnology. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name entry element | Nanotechnology. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name entry element | Joints (Engineering) |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name entry element | Sealing (Technology) |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name entry element | Metal bonding. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name entry element | Microelectronics. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name entry element | Nanoelectronics. |
| 700 1# - ADDED ENTRY--PERSONAL NAME | |
| Personal name | Zhou, Y. |
| 710 2# - ADDED ENTRY--CORPORATE NAME | |
| Corporate name or jurisdiction name as entry element | Institute of Materials, Minerals, and Mining. |
| 856 40 - ELECTRONIC LOCATION AND ACCESS | |
| Materials specified | Download: Knovel |
| Uniform Resource Identifier | <a href="https://app.knovel.com/hotlink/toc/id:kpMN000003/microjoining-nanojoining/microjoining-nanojoining">https://app.knovel.com/hotlink/toc/id:kpMN000003/microjoining-nanojoining/microjoining-nanojoining</a> |
| 907 ## - LOCAL DATA ELEMENT G, LDG (RLIN) | |
| a | .b1223204x |
| b | mngc |
| c | n |
| 902 ## - LOCAL DATA ELEMENT B, LDB (RLIN) | |
| a | 251209 |
| 998 ## - LOCAL CONTROL INFORMATION (RLIN) | |
| Operator's initials, OID (RLIN) | 0 |
| Cataloger's initials, CIN (RLIN) | 190207 |
| First date, FD (RLIN) | e |
| -- | h |
| -- | n |
| -- | 0 |
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