AI SearchControl charts and quality related statistical applications in industry
Call Number: AIT RSPR no. IE-87-16 Material type:
SeriesSeries: Asian Institute of Technology. Research studies project report ; no. IE-87-16Publication details: Bangkok : Asian Institute of Technology, 1987Description: 1 v. (various pagings)Subject(s): Online resources: Dissertation note: Research Studies Project Report (M. Eng.) - Asian Institute of Technology, 1987 Summary: The semiconductor industry in the Third World is basically subassembling . To remain competitive, the subassemblers are expected to come up with products with high quality, low cost and delivered on time. This study focuses on two critical operations in semiconductor s ubassembling. The operations considered were lead bonding and molding. Control charts techniques are applied to the lead bonding operation in order to monitor machine performance. Multivariate analyses are used in the molding operation to derive causal relationships between input and output variables. From this relationships, an empirical approach was undertaken to find t he "Safe Operating Re gion" in the molding parameters. Though the study was done in a specific plant, the processes involved are not unique to semiconductor subassembling and therefore, the techniques used are applicable to other semiconductor sub assembling plants.
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Asian Institute of Technology Library Archives | AIT RSPR no. IE-87-16 (Browse shelf(Opens below)) | Available | 30050160109277 |
A research study submitted in partial fulfilment of the requirements for t h e degree of Master of Engineering, School of Engineering and Technology
Research Studies Project Report (M. Eng.) - Asian Institute of Technology, 1987
The semiconductor industry in the Third World is basically subassembling . To remain competitive, the subassemblers are expected to come up with products with high quality, low cost and delivered on time. This study focuses on two critical operations in semiconductor s ubassembling. The operations considered were lead bonding and molding. Control charts techniques are applied to the lead bonding operation in order to monitor machine performance. Multivariate analyses are used in the molding operation to derive causal relationships between input and output variables. From this relationships, an empirical approach was undertaken to find t he "Safe Operating Re gion" in the molding parameters. Though the study was done in a specific plant, the processes involved are not unique to semiconductor subassembling and therefore, the techniques used are applicable to other semiconductor sub assembling plants.
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