A thesis submitted in partial fulfillment of the requirements for the degree of Master of Engineering in Microelectronics Engineering, School of Engineering and Technology

Thesis (M.Eng.) - Asian Institute of Technology, 2007

Integrated circuits tend to be as small as possible, because customers want more powerful simpler and inexpensive devices. With modem silicon based, microprocessors fabricated with 45-nm technology. Although the cost per chip is reduced due to miniaturization, the start-up investment for new processing plants increases at par. For low-cost electronic devices such as RFID antennas, display devices, printed circuit boards, etc. which do not need such high performance, it is not reasonable to use modem microelectronic fabrication facilities and complicated processes. Moreover conventional microfabrication of devices needs a long time to prepare, needs elaborate steps to create only one layer and use a lot of chemicals that are detrimental to our environment. Direct writing technique is a method to overcome some of these drawbacks where such fine structures are not necessary. Directwriting manufacturing process utilizes transfer of digital patterns from computers to physical substrates such as silicon wafer, plastic, paper, etc. The process significantly reduces amount of material used since waste is reduced drastically. Even though this technique can only write features in micro scales, there are a plenty of applications which do not require smaller resolutions. In this study, ink-jet printing for electronics was realized on a commercial printer and a customized printer. The customization of the printer allowed better flexibility for the fabrication of electronic devices. Gold and silver nanoparticles were deposited as passive components. Further optimization especially of the nanoparticle ink is required to achieve ink jetted functional electronic devices.