TY  - SER
AU  - Das,Anwesh
AU  - Dutta,Joydeep
AU  - Hornyak,Louis
AU  - Mohammed,Waleed S.
ED  - Asian Institute of Technology Fellowship,
TI  - Characterization of layer-by-layer electrostatically self-assembled thin films of chitosan capped gold and silica nanoparticles on conducting substrates and its potential application as a press sensor
T2  - Thesis
PY  - 2012///
CY  - Pathum Thani
PB  - Asian Institute of Technology
KW  - Nanoparticles
KW  - Thin films
KW  - Chitosan
N1  - A thesissubmitted inpartial fulfilment of the requirements for the degree of Master of Engineering in Nanotechnology, School of Engineering and Technology; Thesis (M. Eng.) - Asian Institute of Technology, 2012
N2  - This dissertation focuses on the growth and characterization of chitosan capped goldand silica bi-layer thin films. Thin films have been prepared from colloidal nanoparticulate solutions  of  gold  and  silica.  They  were  transferred  onto  solid  substrates  through  Layer-by-layer dip-coating process,by dipping the substrates back and forth in the oppositely charged solutions   using   the   concept   of   self-assembly   of   oppositely   charged   entities.   Gold nanoparticles   capped  with  polymer   chitosan  served   as  the  positive   entity  and  silica nanoparticles as the negative entity.Different sizes of silica nanoparticles were synthesized and characterized by varying the  various  reaction  parameters.  Effect  of  increasing  silica  particle  size  on  bi-layer  growth process was also studied.In order to achieve a good coating of the bilayerson the substrate, attachmentof the firstsilanemono-layer is  very  important.  Role  of  different  solvents  was  studied  during silanization process. It was analysed and better attachment was obtained byoptimization of various parameters.Role  of  buffers  on  the  growth  of  bi-layers  wasstudied.  Citrate  and  borate  buffers have been used as acidic and basic buffers respectively.Finally,  electrical  characterization  on  Transparent  conducting  oxide  substrates  and metallic substrates were done to check the electrical behaviour of the stackedbi-layers
UR  - http://203.159.5.9/ait-thesis/detail.php?qid=B03382 
ER  -