02245cas a2200241 a 450000500170000000800410001703500150005810000300007324500760010326000520017930000100023149000270024150001520026850200570042052011790047765000270165670000380168370000550172170000470177671000560182381000590187985600650193820260817173436.0110910s1986    th uu|m rtt   0|  a1eng d  a.b100257770 aRungnaphar Pongsawatmanit12aA comparison of dry and wet grinding processes for preparing corn chips  aBangkok :bAsian Institute of Technology,c1986  a47 p.1 aThesis ;vno. AE-86-23  aA thesis submitted in partial fulfillment of the requirements for the degree of Master of Science, School of Environment, Resources and Development  aThesis (M.Sc.) - Asian Institute of Technology, 1986  aIn this study, the quality aspects of fried corn chips prepared from wet and dry grinding processes were compared. The effects of corn boiling and grinding times were evaluated to  determine optimum conditions. In the wet process, the fried chips  prepared from 10 h of soaking, 30 minutes of boiling and 3 passes  of grinding resulted in the best quality. Corn chips prepared from  the dry process gave better quality than those prepared from the  wet grinding process, especially when the flour was produced from  a single pass of grinding.  A continuous extrusion type chip-forming machine was successfully designed, fabricated and tested for its performance. It  was found that die thickness and screw speed influenced the  puffiness of chips. In general, the chips formed by screw extruder  were found to be more satisfactory in eating quality.  A comparison of the approximate operating costs of the dry  and wet processes revealed the dry grinding process to be more  costly due to the drying of corn after boiling. However, the dry  process offered the flexibility with regard to prolonged storage  of gelatinized flour, and quick and easy preparation of the chips . 0aCorn products industry1 aJindal, Vinod Kumar,eChairperson1 aIllangantileke, Sarath G., eExamination Committee1 aGupta, Chandra P., eExamination Committee2 aUnited states of America/ASEAN, eScholarship Donor2 aAsian Institute of Technology.tThesis ;vno. AE-86-23  3Full-Textuhttp://203.159.5.9/ait-thesis/detail.php?q=B19584