Advances in CMP/polishing technologies for the manufacture of electronic devices / 
edited by Toshiro Doi, Ioan D. Marinescu, Syuhei Kurokawa 
 - 1st ed. 
 - Oxford :  Elsevier,  2012. 
 - 1 online resource (xii, 317 pages) :  illustrations, color portraits 
<br/><br/>Includes bibliographical references and index 
<br/><br/> CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. --P. 4 of cover 
<br/><br/><label>ISBN: </label>9781437778601 1437778607 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Grinding and polishing