01174cam a2200277Ma 4500 20260817161655.0 111221s2012 enkacd ob 001 0 eng d 9781437778601 1437778607 .b12251422 Advances in CMP/polishing technologies for the manufacture of electronic devices / edited by Toshiro Doi, Ioan D. Marinescu, Syuhei Kurokawa 1st ed. Oxford : Elsevier, 2012. 1 online resource (xii, 317 pages) : illustrations, color portraits Includes bibliographical references and index CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. --P. 4 of cover Grinding and polishing Doi, Toshiro K., 1947- Marinescu, Ioan D. Kurokawa, Syuhei Download: Knovel https://app.knovel.com/hotlink/toc/id:kpACMPPTM3/advances-in-cmp-polishing/advances-in-cmp-polishing .b12251422 mngc n 251209 0 190207 e h n 0 2233 2233