Doi, Toshiro K. 1947- Marinescu, Ioan D. Kurokawa, Syuhei text bibliography enk Oxford Elsevier 2012 1st ed. monographic eng 1 online resource (xii, 317 pages) : illustrations, color portraits CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. --P. 4 of cover edited by Toshiro Doi, Ioan D. Marinescu, Syuhei Kurokawa Includes bibliographical references and index Grinding and polishing 9781437778601 1437778607 https://app.knovel.com/hotlink/toc/id:kpACMPPTM3/advances-in-cmp-polishing/advances-in-cmp-polishing https://app.knovel.com/hotlink/toc/id:kpACMPPTM3/advances-in-cmp-polishing/advances-in-cmp-polishing 111221 20260817161655.0