01140cam a2200265Ma 450000500170000000800410001702000180005802000150007603500150009124501460010625000120025226000310026430000730029550400500036852001550041865000270057370000280060070000230062870000210065185601230067290700250079590200110082099800280083199900150085920260817161655.0111221s2012    enkacd  ob    001 0 eng d  a9781437778601  a1437778607  a.b1225142200aAdvances in CMP/polishing technologies for the manufacture of electronic devices /cedited by Toshiro Doi, Ioan D. Marinescu, Syuhei Kurokawa  a1st ed.  aOxford :bElsevier,c2012.  a1 online resource (xii, 317 pages) :billustrations, color portraits  aIncludes bibliographical references and index3 aCMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. --P. 4 of cover 0aGrinding and polishing1 aDoi, Toshiro K.,d1947-1 aMarinescu, Ioan D.1 aKurokawa, Syuhei403Download: Knoveluhttps://app.knovel.com/hotlink/toc/id:kpACMPPTM3/advances-in-cmp-polishing/advances-in-cmp-polishing  a.b12251422bmngc cn  a251209  b0c190207deeh  fng0  c2233d2233