<?xml version="1.0" encoding="UTF-8"?>
<mods xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xmlns="http://www.loc.gov/mods/v3" version="3.1" xsi:schemaLocation="http://www.loc.gov/mods/v3 http://www.loc.gov/standards/mods/v3/mods-3-1.xsd">
  <titleInfo>
    <title>Cylindrical heat pipes for the cooling digital light processing projector</title>
  </titleInfo>
  <name type="personal">
    <namePart>Narong Pooyoo</namePart>
    <role>
      <roleTerm authority="marcrelator" type="text">creator</roleTerm>
    </role>
  </name>
  <name type="personal">
    <namePart>Kumar, Sivanappan</namePart>
    <role>
      <roleTerm type="text">Chairperson</roleTerm>
    </role>
  </name>
  <name type="personal">
    <namePart>Athapol Noomhorm</namePart>
    <role>
      <roleTerm type="text">Examination Committee</roleTerm>
    </role>
  </name>
  <name type="personal">
    <namePart>Salam, Abdul P.</namePart>
    <role>
      <roleTerm type="text">Examination Committee</roleTerm>
    </role>
  </name>
  <name type="corporate">
    <namePart>National Science and Technology Development Agency (NSTDA), Thailand</namePart>
    <role>
      <roleTerm type="text">Scholarship donor</roleTerm>
    </role>
  </name>
  <typeOfResource>text</typeOfResource>
  <genre authority="marc">series</genre>
  <genre authority="marc">technical report</genre>
  <originInfo>
    <place>
      <placeTerm type="code" authority="marccountry">th</placeTerm>
    </place>
    <place>
      <placeTerm type="text">Pathum Thani, Thailand</placeTerm>
    </place>
    <publisher>Asian Institute of Technology</publisher>
    <dateIssued>2015</dateIssued>
    <issuance>continuing</issuance>
  </originInfo>
  <language>
    <languageTerm authority="iso639-2b" type="code">eng</languageTerm>
  </language>
  <physicalDescription>
    <extent>313 p.  : ill.</extent>
  </physicalDescription>
  <abstract>Electronic devices use heat pipes to  transfer heat efficiently and  help in the miniaturization of  these  devices.  The  application  of  cylindrical  he at  pipes  for  cooling  Digital  Light  Processing   (DLP)  projector  can  improve  heat  transfer,  sa ve  space,  reduce  noise  and  weight  of  the  DLP   projector,  and  is  the  topic  of   this  research.  Accordingly,  the  specific  objectives  of  the  study   were:  to  study  the  performan ce  of  cylindrical  heat  pipes  by  numerical  modeling  and   simulation  studies  using  pure  water  and  nanof luid  as  working  fluids  and  including  non- condensable  gas  effect;  to  desi gn,  fabricate  and  to  experimental ly  investigate  a  cylindrical   heat  pipe  for  cooling  a  DLP  projector  (a   Digital  Micro  mirror  De vice  (DMD)  and  a  Ultra   High Performance (UHP) lamp) and compare its  actual performance with simulation results.  To achieve the above noted objectives, earlier st udies were first reviewed. Heat pipes are not  used  commonly  for  cooling  DLP  projectors.  The   main  steps  of  design  and  construction  of   heat  pipes  were:  problem  specifi cation,  selection  of  liquids  ma terials  and  wick  structure,   application  of  design  procedures,  finding  optio nal  solutions  and  evaluation  of  performance.   The  performance  of  cylindrical  heat  pipe  can   be  evaluated  by  considering  the  thermal   resistance  of  the  outer  wall  temperature  di stribution  along  the  cylinder.  The  outer  wall   temperatures  obtained  by  numerical  simulatio n  is  in  good  agreement  with  experimental   observation at the evapor ator. However, difference is observe d at the condenser section. It is  also  observed  that  the  cylindrical  heat  pipe   using  pure  water  as  work ing  fluids  shows  the   velocity vector inside cylindrical  heat pipe differ from values obtained using the principles of  heat pipe operation. Besides, ve locity vector and pressure pr ofile for nanofluid thermosyphon  heat pipe is not available, and the simulati on results considering non-condensable gas effect  are  different  from  those  obtained  from  the  ex perimental  results.  These  research  gaps  are   therefore addresse d in this study.   A  numerical  model  was  develope d  considering  pure  water  as  th e  working  fluid  taking  into   account the non-Darcian transport  in liquid-vapor domain and ma ss flow rate at liquid-vapor  interface domain. Then, this model was extended  to nanofluid and non-condensable gas effect  of cylindrical heat pipe using CFD commercia l software. A 3D numerical simulation on pure  water   and   nanofluid   including   non-condensab le   gas   mixture   considering   non-Darcian    transport  and  mass  flow  rate  at  liquid-vapor   interface  model  was  conducted  and  the  results   show  that  they  are  in  good  agreement  with  ea rlier  analytical  and  e xperimental  results.  The   velocity  vector  and  pressure  pr ofile  inside  cylindric al  heat  pipe  also  are  in  good  agreement  with  the  principle  of  heat  pipe  operati on.  These  models  (considering  pure  water  and   nanofluid) were therefore used to design cylindr ical heat pipe for cooling DLP projector.   An  experimental  setup  to  study  the  thermal  resi stance  of  cylindrical  heat  pipe  for  cooling   DLP projector considering R134a, pure water  and nanofluid and non-condensable gas effect  was  fabricated.  Experiments  were   conducted  to  (a)  ev aluate  the  performance  of  cylindrical   heat pipe and to show th e junction temperature of DMD (to be less than 60  {u0528}  and UHP lamp  less  than  118   {u0528} )  using  natural  convection,   (b)  compare  the  performan ce  of  cylindrical  heat   pipe  considering  water,  nanof luid  and  the  effect  of  non-c ondensable  gases  considering   ambient  temperature  and  inclinat ion  variation  (to  simulate  the   projector  inclination  and  the   projector operation in different ambient temper ature), (c) investigate  the performance of DLP  projector  working  with  cylindri cal  heat  pipe,  and  (d)  evaluate   the  effect  on  luminance  on   projector  screen  and  power  consumption  usin g  cylindrical  heat  pi pe.  The  experimental   apparatus  has  rectangular  tunnel   feature,  which  can  measure  th e  temperature  distribution  on  the outer wall of cylindrical h eat pipe, junction temperature of  DMD and UHP lamp and heat  sink  temperature.  Four  types  of  experiments   were  conducted  using:  R134a  (for  cooling   DMD),  pure  water,  nanofluid  (for  cooling  UHP   lamp)  and  non-condensable  gas.  Two  plate   heaters were inserted in the heating block to  simulate heat source from DMD and UHP lamp  of DLP projectors. The power s upply to the heaters wa s controlled by using  an inverter. They  were  set  to  provide  maximum  power  input   of  47  W  for  UHP  cooling  and  8  W  for  DMD   cooling.  The  surface  temperature  of  heating  bl ock  (to  simulate  the  ju nction  temperature  of   UHP  and  DMD)  was  also  measured  under  power   supply  changes  and  ambient  temperature   changes.  Thermal  resistance  of  cylindrical  heat   pipe  in  the  four  cases  was  obtained  from   measurements of the outer wall temperature.  R134a cylindrical heat pipe-heat sink was then  mounted on a DMD and two types of cylindrical  heat pipes (pure water  and nanofluids) were  integrated  to  UHP  lamp  for  evaluation  of  the  cylindrical  heat  pipe  combined  with  the  DLP   projector.  Besides,  the  inte rface  temperature  between  UHP  lamps  and  heating  block  and   between  DMD  and  heating  block,  power  consumption  and  illumination  on  screen  of  DLP   projector, were also investigated.   The study results show that two L-shaped cylindr ical  heat  pipes  with  screen  mesh  wick  and   one L-shaped cylindrical heat pipe with screen  mesh wick using copper container are suitable  for  cooling  47  W  UHP  lamp  and  8  W  DMD,  re spectively. The numerical simulation results  of  the  outer  wall  temperatur e  distribution  considering  R134 a,  pure  water  and  nanofluids   cylindrical  heat  pipes  agrees   well  with  experimental  re sults.  Among  the  water-copper,   nanofluid-copper  and  non-condensable  gas  mixt ure  in  cylindrical  he at  pipes,  nanofluid- copper cylindrical heat pipe has the lowest th ermal resistance, while the non-condensable gas cylindrical  heat  pipe  has  th e  highest  thermal  resistance.   The  two  water-copper  and  two   nanofluid-copper  cylindrical  heat  pipes  can  ma intain  the  surface  temperature  of  the  heating   block (to simulate UHP lamp junction temperature) at 80  {u0528}  and 82  {u0528} , respectively and the  R134a-copper  cylindrical  heat  pipe  can  control  surface  temperature  heating  block  (to   simulate DMD junction temperature) below 60   {u0528} . The outer wall temp erature of nanofluid- copper  cylindrical  heat  pipe,  water  cylindric al  heat  pipe  and  the  non-condensable  gas   cylindrical  heat  pipe  tend  to  decrease  with  le ss  inclination,  higher  ambient  temperature  and   higher  heat  inputs.  For  the  projector,  the  wa ter  cylindrical  heat  pi pe  has  the  UHP  lamp   junction  temperature  (99  {u0528} ).  The  R134a-copper  cylindrical  heat  pipe  for  cooling  DMD  can   maintain  DMD  junction  temperature  at  41   {u0528},   below  the  existing  cooling  system.  The   electricity consumption and luminosity of water-coppe r cylindrical heat pipe  is similar to that  of  the  existing  cooling  system.  The  lifetime   of  UHP  lamp  and  DMD  in  DLP  projector  is   increased. Therefore, the cylindrical heat pipe ca n be used instead of fan and can also lead to  miniaturization of projector. </abstract>
  <note>A dissertation submitted in partial fulfillment of the requirements for the degree of Doctor of Engineering in Energy, School of Environment, Resources and Development</note>
  <note>Thesis (Ph.D.) - Asian Institute of Technology, 2015</note>
  <subject authority="lcsh">
    <topic>Heat pipes</topic>
  </subject>
  <subject authority="lcsh">
    <topic>Lighting</topic>
  </subject>
  <relatedItem type="series">
    <titleInfo>
      <title>Dissertation ; no. ET-15-01</title>
    </titleInfo>
    <name type="corporate">
      <namePart>Asian Institute of Technology.</namePart>
      <namePart/>
    </name>
  </relatedItem>
  <identifier type="uri">http://203.159.5.9/ait-thesis/detail.php?q=B00523</identifier>
  <location>
    <url displayLabel="Full-Text">http://203.159.5.9/ait-thesis/detail.php?q=B00523</url>
  </location>
  <recordInfo>
    <recordCreationDate encoding="marc">170925</recordCreationDate>
    <recordChangeDate encoding="iso8601">20260818085706.0</recordChangeDate>
  </recordInfo>
</mods>
