02273nam a2200253 450000500170000000800410001703500150005810000200007324500760009326000520016930000100022149000270023150001450025850200580040352012090046165000190167065000260168970000410171570000490175670000410180571000490184681000590189585600650195420260818094711.0270798 th eng  a.b102239521 aLeung, Chun-wai10aEconomics and safety of tall building design based on 2D frame analysis aBangkok :bAsian Institute of Technology,c1990 a86 p.1 aThesis ;vno. ST-90-10 aA thesis submitted in partial fulfillments of the requirements for the degree of Master of Engineering, School of Engineering and Technology aThesis (M.Eng.) - Asian Institute of Technology, 1990 aMany three-dimensional multistory tall buildings are analyzed using simplified 2D frame analytical techniques and plane frame computer programs in practice. The accuracy of these design techniques may not be sufficient to ensure an economics and safety design because important factors are neglected in the techniques. To evaluate the economics and safety of tall building design based on 2D frame analysis, tall building models with varying building parameters are tested by 2D frame analysis and more rigorous by 3D analysis. A real case study of tall building in Thailand are tested also. The results show that for frame building system without shearwall, a design based on simplified 2D frame analysis under static or dynamic load is acceptable. Coupled frame-shearwall building will be over-designed if results of 2D analysis are used especially at lower stories for building which basically deform in bending mode and of which the number of stories is above twenty five. Tall building designed from results of a three-dimensional analysis can very well resist the worst loading condition as expected. Building design based on 2D frame analysis is partly over-designed and partly unsafe 0aTall buildings 0aStructures, Theory of0 aWorsak Kanok-Nukulchai,eChairperson0 aPichai Nimityongskul,eExamination Committee1 aUeda, Tamon, eExamination Committee2 aThe Government of Japan, eScholarship Donor2 aAsian Institute of Technology.tThesis ;vno. ST-90-10 3Full-textuhttp://203.159.5.9/ait-thesis/detail.php?q=B18551