02209nas a2200265 a 450000500170000000800410001703500150005810000220007324501010009526000680019630000390026449000270030350001900033050200570052052009660057765000250154365000210156870000370158970000430162670000470166970000500171671000520176681000590181885600660187720260817162317.0090530s2008    th uu|m rtt   0|  a1eng d  a.b120567280 aDang Thi Minh Hue10aAnalysis of clay microstructure using scanning electron microscope and image analysis techniques  aPathum Thani, Thailand :bAsian Institute of Technology,c2008   a98 p. :bill. +e1 online resource1 aThesis ;vno. GE-07-15  aA thesis submitted in partial fulfillment of the requirements for the  degree of Master of Science in Geotechnical and Geoenvironmental Engineering, School of Engineering and Technology  aThesis (M.Sc.) - Asian Institute of Technology, 2007  aMicrofabric studies of soil have been enhanced by using Scanning electron  microscopy (SEM). Through various techniques of image analysis, much research has been done to determine quantitative characteristics of geomorphology of soil microstructure. This research examines the changes in microstructure of clay at Hai Duong and Ha Dong sites in Vietnam due to shearing, consolidating and swelling. Samples that have undergone shearing the structure specimens exhibited face-to-face contact between particles. Consolidation pressure will create the closeness of particles contact. For sample that is affected by swelling, the structure is preserved. This study also reviewed the specimen preparation for microstructural observation in utilizing SEM by two methods: oven drying and critical point drying (CPD). From these results, it has been known that irrelevant permission of drying method may lead to incorrect understanding on the microstructure of clay soil 0aClayxMicrostructure 0aImage processing0 aNoppadol Phien-Wej,eChairperson1 aPham, Huy Giao,eExamination Committee1 aBergado, Dennes T.,eExamination Committee1 aMeer, Freek van Der, eExamination committee 2 aBRIDGE project Fellowship, eScholarship donor 2 aAsian Institute of Technology.tThesis ;vno. GE-07-15  3Full-Textuhttp://203.159.5.9/ait-thesis/detail.php?q=B02976