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008 110910s1986 th uu|m rtt 0| a1eng d
035 _a.b10025777
099 9 _aAIT Thesis no. AE-86-23
100 0 _aRungnaphar Pongsawatmanit
245 1 2 _aA comparison of dry and wet grinding processes for preparing corn chips
260 _aBangkok :
_bAsian Institute of Technology,
_c1986
300 _a47 p.
490 1 _aThesis ;
_vno. AE-86-23
500 _aA thesis submitted in partial fulfillment of the requirements for the degree of Master of Science, School of Environment, Resources and Development
502 _aThesis (M.Sc.) - Asian Institute of Technology, 1986
520 _aIn this study, the quality aspects of fried corn chips prepared from wet and dry grinding processes were compared. The effects of corn boiling and grinding times were evaluated to determine optimum conditions. In the wet process, the fried chips prepared from 10 h of soaking, 30 minutes of boiling and 3 passes of grinding resulted in the best quality. Corn chips prepared from the dry process gave better quality than those prepared from the wet grinding process, especially when the flour was produced from a single pass of grinding. A continuous extrusion type chip-forming machine was successfully designed, fabricated and tested for its performance. It was found that die thickness and screw speed influenced the puffiness of chips. In general, the chips formed by screw extruder were found to be more satisfactory in eating quality. A comparison of the approximate operating costs of the dry and wet processes revealed the dry grinding process to be more costly due to the drying of corn after boiling. However, the dry process offered the flexibility with regard to prolonged storage of gelatinized flour, and quick and easy preparation of the chips .
650 0 _aCorn products industry
700 1 _aJindal, Vinod Kumar,
_eChairperson
700 1 _aIllangantileke, Sarath G.,
_eExamination Committee
700 1 _aGupta, Chandra P.,
_eExamination Committee
710 2 _aUnited states of America/ASEAN,
_eScholarship Donor
810 2 _aAsian Institute of Technology.
_tThesis ;
_vno. AE-86-23
856 _3Full-Text
_uhttp://203.159.5.9/ait-thesis/detail.php?q=B19584
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