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| 008 | 030815s2003 th uzm rtt 00| a1eng d | ||
| 035 | _a.b11893904 | ||
| 099 | 9 | _aAIT Thesis no.ST-03-05 | |
| 100 | 1 | _aYing, JiShun | |
| 245 | 1 | 0 | _aDevelopment of an FRP sandwich bridge deck model |
| 260 |
_aBangkok : _bAsian Institute of Technology, _c2003 |
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| 300 | _a93 leaves | ||
| 490 | 1 |
_aThesis ; _vno. ST-03-05 |
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| 500 | _aA thesis submitted in partial fulfillment of the requirements for the degree of Master of Engineering, School of Civil Engineering | ||
| 502 | _aThesis (M.Eng.) - Asian Institute of Technology, 2003 | ||
| 520 | _aFiber-reinforced plastic (FRP) composite decks have been increasingly used in bridge application, both in new construction and rehabilitation and replacement of existing bridge decks. Recent applications have demonstrated that FRP honeycomb panels can be effectively and economically used for bridge deck systems. This thesis is concerned with design modeling characterization of FRP honeycomb panel with traditional and unique core geometry in the plane and extending vertically between face laminates. The analyses of a FRP honeycomb structure and components include Core wall engineering properties and equivalent core material properties. A homogenization process is used to obtain the equivalent core material properties for the honeycomb geometry. To verify the accuracy of the analytical solution, several sandwich composite plates are tested with GXFINAS. Also, a FRP sandwich bridge deck panel is modeled. Finite element (FE) models of the bridge deck using shell element are used to decide face laminates layers, core thickness. A brief summary is given of present used of the FRP honeycomb panel for bridge deck. The present simplified analysis procedure can be used in design application and optimization of efficient honeycomb structures. | ||
| 650 | 0 | _aFiber reinforced plastics | |
| 650 | 0 |
_aBridges _xFloors |
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| 700 | 1 |
_aKim, Kidu, _eChairperson |
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| 700 | 0 |
_aPichai Nimityongskul, _eExamination Committee |
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| 700 | 0 |
_aPennung Warnitchai, _eExamination Committee |
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| 710 | 2 |
_aAsian Institute of Technology Partial Scholarship, _eScholarship donor |
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| 810 | 2 |
_aAsian Institute of Technology. _tThesis ; _vno. ST-03-05 |
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| 856 |
_3Full-Text _uhttp://203.159.5.9/ait-thesis/detail.php?q=B08876 |
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