Advances in CMP/polishing technologies for the manufacture of electronic devices /
Advances in CMP/polishing technologies for the manufacture of electronic devices /
edited by Toshiro Doi, Ioan D. Marinescu, Syuhei Kurokawa
- 1st ed.
- Oxford : Elsevier, 2012.
- 1 online resource (xii, 317 pages) : illustrations, color portraits
Includes bibliographical references and index
CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. --P. 4 of cover
9781437778601 1437778607
Grinding and polishing
Includes bibliographical references and index
CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. --P. 4 of cover
9781437778601 1437778607
Grinding and polishing

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