Advances in CMP/polishing technologies for the manufacture of electronic devices /

Advances in CMP/polishing technologies for the manufacture of electronic devices / edited by Toshiro Doi, Ioan D. Marinescu, Syuhei Kurokawa - 1st ed. - Oxford : Elsevier, 2012. - 1 online resource (xii, 317 pages) : illustrations, color portraits

Includes bibliographical references and index

CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. --P. 4 of cover

9781437778601 1437778607


Grinding and polishing
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