Advances in CMP/polishing technologies for the manufacture of electronic devices / edited by Toshiro Doi, Ioan D. Marinescu, Syuhei Kurokawa

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TextPublication details: Oxford : Elsevier, 2012.Edition: 1st edDescription: 1 online resource (xii, 317 pages) : illustrations, color portraitsISBN:

9781437778601
1437778607

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Grinding and polishing

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Download: Knovel

Abstract: CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. --P. 4 of cover

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Includes bibliographical references and index

CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. --P. 4 of cover

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Advances in CMP/polishing technologies for the manufacture of electronic devices / edited by Toshiro Doi, Ioan D. Marinescu, Syuhei Kurokawa

AIT

Asian Institute of Technology Library