Advances in CMP/polishing technologies for the manufacture of electronic devices / (Record no. 2233)

MARC details
000 -LEADER
fixed length control field 01174cam a2200277Ma 4500
005 - DATE AND TIME OF LATEST TRANSACTION
control field 20260817161655.0
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION
fixed length control field 111221s2012 enkacd ob 001 0 eng d
020 ## - INTERNATIONAL STANDARD BOOK NUMBER
International Standard Book Number 9781437778601
020 ## - INTERNATIONAL STANDARD BOOK NUMBER
International Standard Book Number 1437778607
035 ## - SYSTEM CONTROL NUMBER
System control number .b12251422
245 00 - TITLE STATEMENT
Title Advances in CMP/polishing technologies for the manufacture of electronic devices /
Statement of responsibility, etc. edited by Toshiro Doi, Ioan D. Marinescu, Syuhei Kurokawa
250 ## - EDITION STATEMENT
Edition statement 1st ed.
260 ## - PUBLICATION, DISTRIBUTION, ETC.
Place of publication, distribution, etc. Oxford :
Name of publisher, distributor, etc. Elsevier,
Date of publication, distribution, etc. 2012.
300 ## - PHYSICAL DESCRIPTION
Extent 1 online resource (xii, 317 pages) :
Other physical details illustrations, color portraits
504 ## - BIBLIOGRAPHY, ETC. NOTE
Bibliography, etc. note Includes bibliographical references and index
520 3# - SUMMARY, ETC.
Summary, etc. CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. --P. 4 of cover
650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Grinding and polishing
700 1# - ADDED ENTRY--PERSONAL NAME
Personal name Doi, Toshiro K.,
Dates associated with a name 1947-
700 1# - ADDED ENTRY--PERSONAL NAME
Personal name Marinescu, Ioan D.
700 1# - ADDED ENTRY--PERSONAL NAME
Personal name Kurokawa, Syuhei
856 40 - ELECTRONIC LOCATION AND ACCESS
Materials specified Download: Knovel
Uniform Resource Identifier <a href="https://app.knovel.com/hotlink/toc/id:kpACMPPTM3/advances-in-cmp-polishing/advances-in-cmp-polishing">https://app.knovel.com/hotlink/toc/id:kpACMPPTM3/advances-in-cmp-polishing/advances-in-cmp-polishing</a>
907 ## - LOCAL DATA ELEMENT G, LDG (RLIN)
a .b12251422
b mngc
c n
902 ## - LOCAL DATA ELEMENT B, LDB (RLIN)
a 251209
998 ## - LOCAL CONTROL INFORMATION (RLIN)
Operator's initials, OID (RLIN) 0
Cataloger's initials, CIN (RLIN) 190207
First date, FD (RLIN) e
-- h
-- n
-- 0

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